Description
The Lam Research 810-107813-306 is an electrostatic chuck (ESC) power supply and high-voltage bias power (HVBP) printed circuit board assembly. It regulates high-voltage DC outputs to clamp semiconductor wafers securely onto the electrostatic chuck inside Lam Research plasma etch or deposition chambers.
Commercial and Logistics Status
| Parameter | Value |
|---|---|
| Condition | Factory Refurbished / New Surplus (Verify specific unit condition upon inquiry) |
| Availability | Subject to current inventory status |
| Standard Lead Time | 3 to 7 business days for processing and transit |
| Warranty | 6 months standard vendor replacement warranty |
| Pricing Note | Price subject to market conditions; contact us for a firm quote |
Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer | Lam Research |
| Part Number | 810-107813-306 |
| Revision | Rev. A (verify compatibility with system rack revision levels) |
| Module Type | ESC Power Supply / High Voltage Bias Power Board (HVBP) |
| Application Environment | Lam Research semiconductor processing equipment chambers |
| Input Power | System-dependent DC rail voltages via backplane connection |
| Output Type | Regulated high-voltage DC for wafer clamping and declamping control |
| Operating Temperature | +15 to +40°C (controlled cleanroom environment) |
| Mounting Type | Rack-mount card cage insertion |
| Weight | Approximately 0.75 kg |
Engineering and Field Integration Notes
During installation within Lam Research tool chassis, strict adherence to electrostatic discharge (ESD) prevention protocols is mandatory.
Integration Guidelines
- Revision Matching: Ensure the 810-107813-306 board revision matches the designated slot requirements and firmware version of the system rack. Mixing incompatible board revisions can lead to communication timeouts or incorrect clamp voltage delivery.
- HV Interlocks: Verify that all high-voltage safety interlocks and grounding straps are securely connected before applying system power to prevent damage to internal switching components or downstream wafer chucks.
- Calibration: Post-installation calibration procedures via the system service software are required to verify clamp and declamping voltage thresholds match tool recipe requirements.
Frequently Asked Questions
Q: Is this board compatible with all Lam Research equipment platforms?
A: No. This part is specific to designated Lam Research tool models utilizing this exact hardware revision. Verify the part number against your system’s bill of materials (BOM) or tool manual before ordering.
Q: Does the board require firmware configuration upon replacement?
A: The board itself operates as a hardware power regulator, but system-level calibration offsets and diagnostic parameters must be verified through the host controller software interface after physical replacement.
