Description
The GE IS200AEADH1A (Functional Acronym: AEAD) is an Input/Output Grid Feedback and Relay Interface Board developed by General Electric for the Speedtronic Mark VI and Mark VIe control platforms. It is deployed primarily in alternative energy control loops—specifically within wind turbine generation systems—as well as standard steam/gas turbine Balance of Plant (BOP) operations. The card functions as an isolated relay output and grid voltage feedback board, bridging low-voltage processor commands with high-power field actuators, main circuit breakers, and grid monitoring assets.
Commercial Availability & Terms
- Condition: New Surplus (Open Box) or Reconditioned Refurbished stock (Fully functional-verification tested on original OEM test fixtures).
- Warranty: 12-Month Functional Warranty on all components.
- Lead Time: Typically ships within 1 to 3 business days from warehouse availability.
- Pricing Note: Price is contingent on current global surplus volume and revision layer suffixes (e.g., H1AAA, H1ABA, H1ACA). Contact our technical procurement desk for a formal, firm quotation.
Technical Specifications
The structural and electrical operating metrics for the open-frame AEAD board are outlined below.
| Parameter | Value |
| Manufacturer | General Electric (GE Industrial / Energy) |
| Model Number | IS200AEADH1A |
| Series Compatibility | Speedtronic Mark VI / Mark VIe Wind Series |
| Functional Acronym | AEAD |
| Board Assembly Type | Standard Assembly PCB (Open Frame, No Faceplate) |
| Onboard Relays | 8 Electromechanical Relays (grouped configuration) |
| Onboard Heat Sinks | 2 high-dissipation aluminum heat sinks |
| Terminal Blocks | 3 parallel vertical-pin terminal strips (12 pins per strip) |
| Interface Connections | Stab-on connectors, plug connectors, and a full right-angled edge connector |
| PCB Protective Coating | Conformal Coating (H1 Environmental Class) |
| Physical Dimensions | Approximately 16.0 cm × 16.0 cm × 12.0 cm (6.3 in × 6.3 in × 4.7 in) |
| Weight | 0.8 kg (1.76 lbs) |
| Country of Origin | United States |
Field Integration & Hardware Topology
1. Form Factor and Mounting Constraints
The IS200AEADH1A is engineered as a rectangular open-frame circuit board lacking an attached front metal faceplate. This structural profile indicates it is not intended for standard front-insertion into a primary VME control rack. Instead, you must mount the module internally within a turbine hub cabinet or a localized junction box utilizing the factory-drilled mounting holes located at each corner of the PCB.
2. Circuit Isolation and Relay Contacts
The 8 onboard mechanical relays provide dry-contact signaling or inductive load driving capabilities. These relays establish physical galvanic isolation between the low-voltage logic core and grid-side circuits. When switching inductive loads (such as heavy solenoid coils or motor starter contactors), ensure external snubber circuits are implemented across the field loops to prevent contact pitting and high-frequency noise injection.
3. Connection Layout
Field and inter-board routing are broken down via three separate physical connector methods:
- Vertical Terminal Strips: Three 12-pin parallel strips handle direct wire terminations.
- Stab-on and Plug Connectors: Designed for rapid bus power distribution loops.
- Right-Angled Connector: Located explicitly along the right edge of the card to integrate directly with backplane or daughterboard expansions.
Field Engineering Note: The AEAD board relies on upstream hardware or the primary application controller for software diagnostics, as it lacks local onboard status LEDs. Monitor the status registers via the ControlST Software Suite to identify missing feedback loops or open relay coils.
Frequently Asked Questions
What does the product code suffix “H1A” indicate?
The “IS200” part defines a normal assembly built in the USA. The “H” designates a specific product variation, “1” indicates the utilization of standard industrial conformal coating for moisture and dust protection, and “A” denotes the initial functional revision layer.
Is the IS200AEADH1A backwards compatible with older revisions?
Revision “A” of this artwork is backwards compatible with standard legacy applications within specified Mark VI parameter guidelines. However, if your system documentation mandates a non-backwards compatible revision “B” update, configuration adjustments within the system software profile may be required.
What are the primary causes of board failure in wind applications?
Because this board functions within high-vibration and thermally cycling environments (such as a wind turbine nacelle or tower base), failure points are typically localized to mechanical fatigue on the relay contacts or degradation of the resistors under sustained thermal loads near the onboard heat sinks. Verify ambient temperature controls during periodic maintenance turnarounds.
