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GE IC695CHS007 RX3i PACSystems 7-Slot Backplane Spares Guide

Original price was: $2,800.00.Current price is: $2,188.00.

Parameter Value / Specification
Model Number IC695CHS007 (CHS007)
Active Brand Emerson Automation (formerly GE Fanuc / GE Intelligent Platforms)
Total Slots 7 physical slots (Slot 0 through Slot 6)
Internal Power Used 240 mA @ 5 V DC, 600 mA @ 3.3 V DC
Input Voltage (TB1) +24 V DC (Isolated input for Series 90-30 / IC694 modules)
Category: SKU: IC695CHS007 Tag:

Description

Meta Description

Optimize inventory management and lifecycle tracking for the GE/Emerson IC695CHS007 7-slot universal backplane. Access critical slot rules, electrical specs, and safety stock.

Field Observation: The Backbone of System Reliability

During a planned upgrade of a mid-sized remote I/O panel at an automotive assembly plant, the installation team encountered intermittent PCI bus drops on a newly populated chassis. The root cause was a physical misalignment of the backplane connectors inside an early revision GE Fanuc IC695CHS007-AA chassis. Without an on-site backup unit, the system integrator was forced to run a makeshift configuration on a damaged backplane, risking bus communication failure across the entire remote hub. This incident highlights a common blind spot in spare parts tracking: the chassis itself. Because backplanes are non-moving, solid-state structures, asset managers frequently omit them from critical inventory lists—forgetting that a backplane failure immediately takes down every CPU, power supply, and I/O module housed within it.

Technical Profile and Field Constraints

The IC695CHS007 is a 7-slot universal backplane from the PACSystems RX3i series. It is equipped with a dual-bus design that natively accommodates both high-speed PCI-based (IC695) modules and serial-based (IC693/IC694) modules.

Parameter Value / Specification
Model Number IC695CHS007 (CHS007)
Active Brand Emerson Automation (formerly GE Fanuc / GE Intelligent Platforms)
Total Slots 7 physical slots (Slot 0 through Slot 6)
Internal Power Used 240 mA @ 5 V DC, 600 mA @ 3.3 V DC
Input Voltage (TB1) +24 V DC (Isolated input for Series 90-30 / IC694 modules)
Mounting Orientation Horizontal mounting only
Dimensions 5.57 in × 10.43 in × 5.80 in (141.4 mm × 264.9 mm × 147.3 mm)
Enclosure Rating NEMA/UL Type 1 (IP20 minimum; IP54 required for hazardous locations)
 

Managing the hardware architecture of this backplane requires strict adherence to physical slot mapping rules:

  • Slot 0: Exclusively reserved for the primary IC695 power supply. No other module type can be inserted here.
  • Slots 1 through 5: Dual-connector slots supporting both the RX3i PCI bus and the RX3i serial bus. These accept CPUs, Ethernet transmitters, and any standard analog/digital I/O.
  • Slot 6: The rightmost slot contains only a PCI connector. It only supports RX3i PCI-based modules—though your mileage may vary if you attempt to force-fit older Series 90-30 modules that rely solely on a serial bus. Well, technically the system is backward-compatible with most legacy IC693 parts, but any serial-only unit must reside in Slots 1 through 5.

Inventory Stratification: ABC Analysis

The physical nature of a backplane changes its priority in your stockroom. We classify the IC695CHS007 as a Class C (Low Cost, High Operational Criticality) asset.

  • Criticality: High. Backplane damage—whether from a physical accident during module installation or a high-current terminal short—completely disables the system local to that chassis.
  • Usage Frequency: Extremely low. Backplanes contain zero mechanical components or high-wear semiconductors.
  • Stocking Recommendation: For sites operating 1 to 5 RX3i systems, keep 1 unit in local storage. For larger multi-chassis sites, maintain a Min/Max of 1/2 units on the shelf to eliminate transit delay in an emergency.

Financial Impacts: Total Cost of Ownership

Chassis do not incur high maintenance costs, but keeping them on a shelf binds capital. The carrying cost for a clean, dry, non-static storage environment averages 15% to 20% of its initial purchase price annually.

Carrying Cost = Purchase Price \times (Storage \% + Insurance \% + Capital Cost \% )

To mitigate these holding costs across multi-facility enterprises, adopt a cross-site sharing methodology. Because the IC695CHS007 is highly compact (weighing only 1.8 kg), stocking a single spare at a central regional warehouse enables swift local shipping to any plant in the region. This vendor-managed or centrally managed pool reduces duplicate inventory purchases by up to 50% across a network of facilities.

Vendor Sourcing and Lifecycle Risk

Following Emerson’s acquisition of GE Intelligent Platforms, both GE-branded and Emerson-branded variants of the IC695CHS007 are active in global supply chains.

  • Active/Classic Phase: This universal 7-slot chassis remains actively manufactured and supported. However, direct distributor lead times occasionally fluctuate past 6 weeks.
  • Sourcing Revisions: Pay close attention to the revision suffix during procurement. Revision AA is the initial release, while revision BA features an extrusion change with an upper guide ledge. This guide ledge reduces the risk of recessed or bent pins when inserting wide PCI-based modules into the backplane connectors. Always demand the BA revision (or later) to minimize installation damage during hot-swaps.

Not recommended for: Expanded configurations requiring more than 5 general-purpose I/O modules. For high-density systems with large numbers of local rack expansion modules, specify the 12-slot (IC695CHS012) or 16-slot (IC695CHS016) backplanes instead to prevent immediate physical space limitations.

Quick Conclusions

  • Prefer Revision BA: Sourcing newer revisions reduces connector pin damage during maintenance.
  • Plan Around Slot 6: Do not place serial-only legacy Series 90-30 I/O modules in Slot 6.
  • Confirm Terminal Grounding: Always connect the integrated grounding bar on the chassis to the panel’s single-point ground.
  • Provide Cooling Gaps: Leave at least 4 inches (102 mm) of clearance on all four sides of the chassis to allow natural convective airflow.

FAQ

Why does the IC695CHS007 backplane feature an isolated +24 V DC terminal strip (TB1)?

Some legacy IC693 and IC694 modules require an external source of isolated 24 V DC to power their field-side interface electronics. Because RX3i IC695 power supplies do not distribute isolated 24 V DC across the backplane pins, this external voltage must be wired directly to the TB1 terminal strip on the left side of the chassis.

Can this backplane be mounted vertically in a narrow enclosure?

No. The IC695CHS007 is designed for horizontal mounting only. Mounting it vertically restricts natural convective airflow, causing hot spots on the installed processors and power modules that shorten hardware life.

How do I calculate safety stock levels when transitioning away from old Series 90-30 hardware?

When migrating legacy cabinets to the RX3i platform, inventory requirements shift. Use a safety stock buffer calculation based on lead-time variance:

Safety Stock = (Worst-case Supplier Lead Time – Typical Sourcing Lead Time) \times Expected Burn Rate

Because backplane failures are rare events, the average burn rate is low. However, when migrating a whole plant floor, keep a baseline buffer of at least 1 spare IC695CHS007 chassis to cover any physical installation errors during the transition window.

Channel Adaptation Notes

Product Page Metadata & Structure

  • Layout: Place the technical table describing slot assignments and power draw immediately under the field observation. Highlight that this universal backplane fits both GE Fanuc and newer Emerson PACSystems RX3i parts.
  • Lifecycle Flag: Clearly differentiate between original GE surplus units and current-production Emerson-branded hardware to avoid procurement confusion.

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