Description
Unboxing & Hardware Overview
- Manufacturer & Architecture: ABB (Medium Voltage Drives and Power Electronics Division)
- Part Number / Model: 3BHB029573R0003 / OEM Component Code: D3040N65TS02
- Product Type: High-Power Diode Presspack / Disc-Type Power Semiconductor Module
- Physical Dimensions: Heavy-duty disc/hockey-puck style ceramic package designed for high-pressure heatsink clamping
- Estimated Shipping Weight: ~3.5 to 5.0 lbs (1.6 to 2.3 kg) enclosed in industrial anti-static packaging and heavy shock-absorbent cushioning
- Primary Condition Status: Factory New / New Surplus / Matched Pair options available (often delivered in matched sets for multi-phase medium-voltage converter stacks; verify specific batch pairing requirements prior to installation)
Product Introduction
The ABB 3BHB029573R0003 (incorporating the D3040N65TS02 diode element) is an ultra-high-power semiconductor component engineered for demanding industrial power conversion systems, such as ABB medium-voltage drives (e.g., ACS6000 series), high-voltage DC (HVDC) transmission links, rectifiers for electrochemical processes, and heavy railway traction setups.
Utilizing a robust “presspack” (hockey-puck) configuration, this diode is designed to be clamped securely between two liquid- or air-cooled heat sinks. This configuration provides exceptional thermal contact, outstanding surge current resilience, and superior thermal cycling stability compared to standard modular packages, ensuring reliable rectification of AC to high-voltage DC under extreme operating loads.
Core Technical Specifications
| Parameter | Value |
| Product Model | 3BHB029573R0003 (D3040N65TS02) |
| Component Type | High-Power Diode Presspack (Disc-Type Rectifier Diode) |
| Repetitive Peak Reverse Voltage (V_{RRM}) | 6,500 V (6.5 kV) |
| Average On-State Current (I_{FAV}) | ~2,920 A |
| Housing Design | Hermetically sealed ceramic disc package (Presspack) |
| Cooling Interface | Requires dual-side heatsink clamping with specified mounting force (kN) |
| Operating Junction Temperature | Up to +125^\circC / +150^\circC max operational threshold |
| Storage Temperature | -40^\circC to +85^\circC (-40^\circF to +185^\circF) |
Compliance & Standards Alignment
- Manufactured in strict accordance with ABB semiconductor quality specifications, international IEC standards for power semiconductors, and industrial environmental guidelines.
- Built to handle severe electrical fault currents, high dv/dt transients, and harsh thermal load profiles typical of utility-scale power electronics.
Technical Note: Presspack diodes rely entirely on precise mechanical clamping force to establish electrical and thermal contact with heat sinks. Under-clamping leads to high contact resistance, localized overheating, and catastrophic component failure, while over-clamping can fracture the internal silicon wafer. Always use a calibrated torque wrench and follow the exact clamping force (kN) recommendations outlined in ABB’s technical mounting manual.
Storage & Asset Preservation Guidelines
- Store the diode presspack in its original factory protective packaging within a clean, dry, climate-controlled indoor environment.
- Keep the silver-plated pole piece contact surfaces entirely free of fingerprints, oils, dust, or oxidation. Clean surfaces with an approved solvent (such as anhydrous isopropyl alcohol) immediately prior to assembly if needed.
- Avoid mechanical dropping, heavy lateral shocks, or resting any physical weight directly on the ceramic collar of the puck.
Physical Installation Prerequisites
- Ensure that all medium-voltage converter stacks, DC bus links, and local power feeds are completely isolated, discharged, grounded, and locked out (LOTO) for a safe duration before performing mechanical maintenance.
- Inspect mating heatsink surfaces for flatness, burrs, or pitting; clean thoroughly to ensure optimal thermal transfer.
- Apply a thin, uniform layer of manufacturer-approved thermal interface compound if specified, and verify clamping force using a dedicated hydraulic or torque-calibrated clamping tool.
Buyer’s FAQ & Logistics
Q: What Harmonized System (HS) code applies to this ABB diode presspack?
A: High-power semiconductor diodes, rectifying elements, and electronic power conversion components typically classify under HS code 8541.10 (Diodes, other than photosensitive or light-emitting diodes) or 8504.40. Confirm final details with your customs broker.
Q: Are these diodes supplied as individual units or matched pairs?
A: Because high-power converter circuits demand balanced current sharing across parallel or series paths, presspacks like part 3BHB029573R0003 are frequently supplied in matched manufacturer pairs or sets. Always verify order quantities against your inverter phase module blueprint.
Q: Is the listed online price final for procurement?
A: Note: Price is subject to market availability, precious metal content variations (silver plating), and global logistics tiers; contact our technical sales desk for a formal, time-sensitive quotation.
