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GE Fanuc IC695PNC001 | CE Certified PROFINET Controller

Original price was: $2,188.00.Current price is: $2,008.00.

Parameter Value
Module Type PROFINET Controller (Version 2.2 General Class A)
Backplane Support RX3i Universal Backplane (Main Rack Only)
Internal Power Draw (3.3 VDC) 0.5 A baseline (up to 1.2 A with dual SFP devices)
Internal Power Draw (5.0 VDC) 1.5 A maximum
Heat Dissipation 14.2 BTU/hr operational thermal output
Memory Limits 128 KB combined input/output communication memory
Category: SKU: IC695PNC001 Tag:

Description

  • Model & Brand: GE Fanuc / Emerson PACSystems RX3i IC695PNC001
  • Physical Dimensions: 128 mm x 103 mm x 70 mm (Single-slot universal backplane module)
  • Estimated Shipping Weight: 0.68 kg (Packaged in industrial anti-static foam carton)
  • What’s in the Box: Printed circuit board assembly with extruded aluminum faceplate, dual RJ-45 ports, dual SFP cages, Micro USB configuration port, and factory inspection certificate.

Engineers plug this communication module directly into the main RX3i universal backplane slot to link the central processor with heavy distributed plant networks. High-speed industrial environments demand strict node capacity, routing deterministic packet streams across optical fiber or copper Ethernet links (—which is critical for sub-millisecond motion synchronization).

Network architecture rules dictate that this controller must reside within the primary CPU rack rather than remote expansion drops. Maintain proper bus connection integrity during insertion to prevent backplane pin damage from electrostatic discharge.

Parameter Value
Module Type PROFINET Controller (Version 2.2 General Class A)
Backplane Support RX3i Universal Backplane (Main Rack Only)
Internal Power Draw (3.3 VDC) 0.5 A baseline (up to 1.2 A with dual SFP devices)
Internal Power Draw (5.0 VDC) 1.5 A maximum
Heat Dissipation 14.2 BTU/hr operational thermal output
Memory Limits 128 KB combined input/output communication memory
Communication Ports 2x RJ-45 Ethernet, 2x SFP fiber cages, 1x Micro USB setup port
Operating Temperature 0°C to +60°C ambient enclosure range
Vibration Resistance 1G operational acceleration from 10 to 500 Hz
Maximum Device Capacity 64 I/O devices per controller (255 per network)

Auditors inspecting high-speed automation networks require formal paperwork verifying electrical safety and emission compliance. This network controller carries major international agency approvals.

  • CE Mark: Confirms adherence to European Union electromagnetic compatibility (EMC) and low-voltage standards.
  • UL/cUL Listed: Validates North American industrial control safety requirements for ordinary locations.
  • ATEX / IECEx: Permits safe operation inside hazardous Class I Division 2 or Zone 2 areas when housed in sealed enclosures.
  • RoHS Compliance: Restricts hazardous material content in electronic manufacturing processes.

Compliance Note: A UL listing ensures internal component spacing prevents arc flash propagation during power surges. Verify specific lot conformity directly with Emerson or GE Fanuc prior to final audit reviews.

Dormant network interface cards suffer from internal crystal drift and semiconductor corrosion if warehouse environments lack strict climate control. Technicians should manage shelf inventory using rigorous preservation steps.

Keep the module sealed tightly inside its original anti-static (ESD) moisture-barrier bag to shield sensitive transceiver circuits from electrostatic fields. Maintain storage room relative humidity strictly below 60% to prevent micro-oxidation on the backplane edge connector fingers. If inventory records indicate the unit has sat on a shelf past 24 months, execute a controlled bench power test to verify microcontroller stability before field deployment.

Backplane slot allocation and thermal parameters dictate physical placement inside the cabinet. Leave at least 50mm of clearance above and below the rack chassis to allow natural convective airflow across the extruded aluminum faceplate. Secure the module firmly using the spring-loaded retention latches to maintain low-impedance ground continuity with the metallic backplane chassis.