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GE Fanuc IC695CPE330 | CE Certified CPU Module

Original price was: $999.00.Current price is: $988.00.

Parameter Value
Processor Architecture 1 GHz dual-core microprocessor
User and Program Memory 64 MB configurable non-volatile flash storage
Ethernet Interfaces Two independent 10/100/1000 Mbps LAN ports
Maximum Program Blocks 512 blocks (up to 128 KB per block)
Power Consumption (24 VDC) 0.625 A maximum draw
Heat Dissipation 30 BTU/hr operational thermal output
Category: SKU: IC695CPE330 Tag:

Description

  • Model & Brand: GE Fanuc / Emerson PACSystems RX3i IC695CPE330
  • Physical Dimensions: 127 mm x 178 mm x 102 mm (Approximate W x H x D, standard 2-slot width module)
  • Estimated Shipping Weight: 1.5 kg (Packaged in customized anti-static foam carton)
  • What’s in the Box: Central processing unit module with metallic housing, dual independent RJ-45 Ethernet ports, USB configuration port, and factory inspection document.

System integrators mount this dual-slot CPU directly into the primary RX3i universal backplane chassis, locking the gold-plated bus connectors tightly into the passive motherboard. High-speed plant architectures require fast instruction execution combined with independent Ethernet LAN processing channels to manage deterministic field data streams (—which is vital for synchronizing multi-tier networks).

Panel builders must assign adequate cooling space around the CPU faceplate to prevent localized thermal accumulation. Ensure the system rack maintains solid low-impedance ground bonding before powering up the central controller.

Parameter Value
Processor Architecture 1 GHz dual-core microprocessor
User and Program Memory 64 MB configurable non-volatile flash storage
Ethernet Interfaces Two independent 10/100/1000 Mbps LAN ports
Maximum Program Blocks 512 blocks (up to 128 KB per block)
Power Consumption (24 VDC) 0.625 A maximum draw
Heat Dissipation 30 BTU/hr operational thermal output
Operating Temperature -40°C to +70°C ambient enclosure range
Storage Temperature Range -40°C to +85°C
Vibration Resistance 1G operational acceleration from 10 to 500 Hz
Relative Humidity 5% to 95% non-condensing

Auditors require meticulous compliance logs for core processing units governing continuous manufacturing loops. This controller meets recognized international benchmarks.

  • CE Mark: Fulfills European Union directives for electromagnetic compatibility and low-voltage safety.
  • UL/cUL Listed: Validates North American industrial control panel safety requirements.
  • ATEX / IECEx: Certified for safe deployment in hazardous Class I Division 2 explosive atmospheres when housed in sealed cabinets.
  • RoHS Conformance: Restricts hazardous substances in electronic assembly materials.

Compliance Note: A UL listing ensures internal component spacing prevents electrical arc propagation during power transients. Verify specific lot conformity directly with Emerson or GE Fanuc prior to final compliance audits.

Dormant CPU modules suffer from internal battery drain and semiconductor oxidation if warehouse environments lack proper climate management. Technicians should execute specific preservation protocols for shelf inventory.

Keep the module sealed securely inside its original anti-static (ESD) moisture-barrier bag to safeguard sensitive microprocessor pins from electrostatic discharge. Maintain warehouse storage temperatures between 10°C and 30°C with relative humidity kept strictly below 60% to prevent micro-corrosion on the backplane edge connector fingers. If inventory records indicate the unit has sat on a shelf past 24 months, verify the real-time clock backup battery voltage on a bench tester before live cabinet installation.

Backplane slot allocation and cabinet thermal parameters dictate physical placement. Leave at least 50mm of vertical clearance above and below the rack chassis to facilitate natural convection airflow across the metallic enclosure casing. Secure the module firmly using the top and bottom retention latches to maintain proper mechanical stability and earth grounding continuity.